Reflow Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Fluxless Reflow Device SR-300

This is a device characterized by performing reflow under reduced pressure using formic acid without the use of flux. 【Features】 ○ No need for flux application or cleaning processes. ○ Approximately 50% cost reduction is possible, and the installation space can be reduced to about one-third. ○ It can contribute to reducing environmental impact by decreasing CO2 emissions generated during flux cleaning by about 30%. ● For more details, please contact us or download the catalog.

Company：アユミ工業
Price：Other

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[Comprehensive Catalog] Fluxless Reflow Equipment RF Series

It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.

The "Fluxless Reflow Device RF Series" can perform reflow under reduced pressure without using flux. Compared to conventional reflow processes that use flux, it eliminates the need for flux application and cleaning processes, reducing costs by approximately 50% and allowing for a reduction in installation space to about one-third. Additionally, it can reduce CO2 emissions generated during flux cleaning by about 30%, contributing to a decrease in environmental impact. Furthermore, due to the vacuum process, it can be processed without voids. For more details, please download the catalog or contact us.

Company：アユミ工業
Price：Other

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Batch-type plasma reflow device (flux reflow)

Flux-free reflow device for fine wafer bumps. Sample test compatible, achieving energy-saving and short takt processes. Reflow video available.

Achieving flux-free bump reflow with highly reducing H2 radicals generated by high-density plasma (SWP). Reducing the application and cleaning processes of flux. Minimizing wet processes before and after reflow. An energy-saving, space-saving, and clean process that reduces the space, processing, and utilities of wet equipment. A cutting-edge mass production process compatible with 300mm wafers, suitable for batch-type hardware and niche devices with small-diameter substrates. Supporting short-tact batch processing for small-lot production and R&D applications.

Company：神港精機東京支店
Price：Other

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Model 5100 Vacuum and Pressure Reflow Device

Batch-type vacuum pressure reflow that supports next-generation processes and achieves voidless results.

The "Model 5100" is a batch-type vacuum pressure reflow device manufactured by SST Vacuum Reflow Systems. It allows for automatic control of heating and cooling settings with high precision. The uniquely designed IR heater uniformly heats the entire process area while providing temperature feedback control in the process area. It is suitable for mass production of flux-free and void-free soldering for microelectronics packages and electronic components. Additionally, it has a proven track record in glass-metal bonding for RF power devices, crystal devices, image sensors, and in hermetic sealing, vacuum sealing, and lid sealing using eutectic bonding for aerospace and high-end industries. 【Features】 ■ Achieves flux-free and void-free soldering ■ Maximum temperature of 500℃ ■ Vacuum level of 10-5 torr (10-3 Pa) ■ Maximum chamber pressure level of 40 psig (3.7 bar, 0.37 MPa) ■ Realizes precise heating and cooling control ■ Equipped with a system that can optimally control temperature, vacuum, and pressure *For more details, please refer to the PDF materials or feel free to contact us.

Company：テクノアルファ
Price：Other

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Reflow Device "UNI-3116H"

Compact lead-free compatible furnace. Number of heating zones: 3. Device length: 780mm.

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while being compatible with nitrogen. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far infrared, and is a lead-free type that is energy-efficient. 【Features】 ○ 3-zone heating with 780mm N2 reflow ○ Heating method using upper hot air circulation and upper and lower far infrared ○ Ideal for cell production, development, and evaluation applications For more details, please contact us or download the catalog.

Company：アントム
Price：Other

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Small Reflow Device "UNI-6116S"

A high-performance eco machine that pursues the coexistence of reflow performance and eco-friendliness. *Free distribution of the handbook "Characteristics of Far Infrared Reflow" is ongoing!

The UNI-6116S is a reflow oven that thoroughly pursues miniaturization. Most of the delivered units are used in clean environments. It adopts a heating method that combines hot air circulation and far-infrared radiation. It is an energy-saving, lead-free compatible model. 【Features】 ○ All heating zones can be set to 350°C ○ High-output heaters are used in the reflow zone ○ Suitable for high melting point solder and AuSn bonding ○ Significantly reduces power consumption ○ Nitrogen-compatible furnace For more details, please contact us or download the catalog.

Company：アントム
Price：5 million yen-10 million yen

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Reflow device "UNI-6116H"

Compact lead-free compatible machine. Number of heating zones: 6. Device length: 1,590mm.

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while still being nitrogen-compatible. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far infrared radiation, and is a lead-free type that is energy-efficient. 【Features】 ○ Combined hot air and far infrared heating from above and below ○ Maximum set temperature of 320℃ ○ Ideal not only for mass production but also for small-batch, diverse production ○ A wide range of options available to accommodate various applications For more details, please contact us or download the catalog.

Company：アントム
Price：Other

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Nitrogen-Compatible Reflow Device 'SOL-6136'

Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,995mm.

The SOL-6136 is a medium-sized reflow oven for mass production lines that employs a heating method combining hot air circulation and far-infrared radiation from both the top and bottom. It is an energy-efficient, lead-free compatible machine that can be universally adapted for various production applications, including consumer electronics, industrial equipment, and EMS. 【Features】 - N2 reflow oven with a total length of less than 3 meters - Low oxygen concentration support of less than 100 ppm (optional) - Standard equipped with a flux recovery system For more details, please contact us or download the catalog.

Company：アントム
Price：Other

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Reflow device "SOLSYS-6310IRTP"

Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,900mm.

The SOLSYS series is a medium-sized reflow oven that employs a heating method combining upper hot air circulation and upper and lower far infrared radiation. It is an effective reflow oven with a "floor heating effect" that helps suppress temperature rise in surface-mounted components. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, which has already contributed to space-saving. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far infrared radiation ○ Effective "floor heating method" for suppressing temperature rise in surface-mounted components ○ Compatible with effective substrate widths up to 310mm ○ Space-saving reflow oven for mass production with a total length of less than 3m ○ Ideal not only for reflow applications but also for screening and curing applications For more details, please contact us or download the catalog.

Company：アントム
Price：Other

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Reflow device "SOLSYS-8310IRTP"

Compact lead-free compatible device. Number of heating zones: 8. Device length: 3,650mm.

The SOLSYS-Series is a medium-sized reflow oven that employs a heating method combining upper hot air circulation and upper and lower far-infrared radiation. It features a "floor heating effect" that is effective when you want to suppress the temperature rise of components on the upper side. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, which has already contributed to space-saving. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Supports effective substrate width up to 310mm For more details, please contact us or download the catalog.

Company：アントム
Price：Other

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[Limited to 5 units] High-performance compact reflow device for atmospheric use UNI-5016A

Opportunity to introduce a new reflow oven at the same price as a used reflow oven!

Recently, many customers have started considering inexpensive used reflow ovens, but the reality is that many of them have become embroiled in troubles caused by the introduction of used reflow ovens. It is likely that due to the current economic situation and budget constraints, most customers feel they have no choice but to opt for inexpensive used reflow ovens. Conversely, if it were possible to introduce a new reflow oven for the same amount of money as a used one, there would be no reason to choose a used reflow oven. In that case, naturally, you would also be able to receive the manufacturer's warranty, and you could use the reflow oven with peace of mind, free from the risks associated with introducing a used reflow oven. We believe that preventing further customers from suffering significant losses due to the introduction of inexpensive used reflow ovens is our mission as a specialized reflow oven manufacturer with 44 years of accumulated technology and experience. This is why we have decided to sell the high-performance compact conveyor reflow oven UNI-5016A. For more details, please contact us or download the catalog.

Company：アントム
Price：Other

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N2 Reflow Device "RN152 Series" *Low power consumption considering the environment

We will exhibit at InterNepCon 2025! Improved temperature uniformity with a new type of nozzle! The N2 reflow device demonstrates astonishing flux recovery performance.

The "RN152 Series" is a high-performance N2 reflow device that exhibits remarkable flux recovery performance. It comes standard with two series of large water-cooled flux recovery units that efficiently recover flux in accordance with flux characteristics and air convection within the furnace. With the adoption of ETC's unique new nozzle and a detailed five-stage wind speed setting, it enables uniform heating without temperature variations for a wide variety of substrates. 【Features】 ■ Remarkable flux recovery performance ■ Dramatically reduces flux adhesion dripping issues ■ Improved temperature uniformity with the new nozzle ■ Easy height adjustment of the labyrinth ■ Environmentally and wallet-friendly low power consumption ■ Reduced time for changing set temperatures (high to low) 【Exhibition Information】 We will be exhibiting at Internepcon Japan 2025 from January 22 (Wed) to January 24 (Fri). We look forward to seeing you at the venue, Tokyo Big Sight (East Hall). *For more details, please refer to the PDF document or feel free to contact us.

Company：エイテックテクトロン
Price：Other

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

Company：日精本社
Price：Other

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

Company：日精本社
Price：Other

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

Company：日精本社
Price：Other

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Vacuum solder reflow device / oxide film reduction device 'RSS-210-S'

Formic acid and hydrogen reduction compatible! Desktop type that can accommodate substrates up to 200mm x 200mm.

This is a tabletop vacuum solder reflow device compatible with both formic acid and hydrogen reduction. Despite its compact size, which is among the smallest in the industry, it supports atmospheric, nitrogen, and reducing atmospheres (formic acid or hydrogen), as well as vacuum reflow. Additionally, it features rapid heating and cooling through a water cooling system, making it suitable for research and development or prototyping. It flexibly accommodates various applications, including solder reflow, reduction treatment of metal oxide films, and sintering of paste materials. **Features** - Achieves zero flux residue by removing oxide films without using flux. - Reaches a maximum temperature of 400°C despite its tabletop size. - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow. - Supports rapid cooling through a water cooling system. - The working area is gas shielded, allowing for use in processes sensitive to contamination and other critical processes. *For more details, please refer to the PDF document or feel free to contact us.*

Company：ユニテンプジャパン
Price：10 million yen-50 million yen

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Solder Reflow Device 'RSS-3X210-S'

Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!

The "RSS-3X210-S" is a solder reflow device that supports both formic gas and hydrogen gas reduction, with enhanced safety features. It can process up to 12 wafers with a diameter of 100mm at once, and is also suitable for reflowing elongated objects such as printer heads and LED lighting. Equipped with 18 high-speed infrared (IR) heaters under the hot plate, it maintains a uniform temperature even in a wide effective heating area, achieving stable heating that is less affected by the heat capacity of the objects. 【Features】 ■ Effective heating area: 630mm x 210mm ■ Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Active water cooling system ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.

Company：ユニテンプジャパン
Price：Other

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Formic Acid Reduction Reflow Device [Case Study: Characteristics of Reflowed Solder]

Solved with the Unitemp reflow device! Significant high-speed cooling! A cooling rate of nearly 3°C per second from solder melting to solidification!

When molten solder takes too long to cool and solidify, it negatively affects the solder joint strength and electrical characteristics. It is a problem if the characteristics deteriorate due to cooling speed issues. Our reflow equipment is equipped with an active water cooling system using circulating cooling water as standard. This allows us to maximize the solder characteristics after reflow. [Case Summary] ■ Issue: If the molten solder takes too long to cool and solidify, it negatively impacts the solder joint strength and electrical characteristics. ■ Solution: - Standard equipped with an active water cooling system using circulating cooling water. - This not only improves the strength and electrical characteristics of the solder but also reduces the tact time. *For more details, please refer to the PDF document or feel free to contact us.

Company：ユニテンプジャパン
Price：Other

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Formic Acid Reduction Reflow Device [Case Study: Temperature Variation within the Substrate]

Solve it with the Unitemp reflow device! Achieve rapid heating! No more worries about damage from unexpected temperatures!

Recent circuit boards are equipped with a wide variety of components, including extremely small chip components, large components, as well as module boards and BGA packages. Since each component has a different thermal capacity, by the time the temperature of the larger components rises, it may exceed the heat resistance temperature of the smaller components, potentially causing defects. If such occurrences happen frequently, it could also affect the yield. Our reflow equipment can rapidly increase the temperature on the heating plate and is designed to avoid overshoot, thereby reducing thermal stress on printed circuit boards and mounted components. Additionally, the entire heating plate is automatically controlled to maintain a uniform temperature, which helps minimize temperature variations affecting the target objects, such as circuit boards. *For more details, please refer to the PDF document or feel free to contact us.*

Company：ユニテンプジャパン
Price：Other

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[Equipment Introduction] Reflow Soldering + Nitrogen Generator

Supports large substrates! Increases operational efficiency with a high-capacity flux recovery unit.

The "Reflow Soldering + Nitrogen Generator" is a reflow device with precise and high-quality heating performance. It has a wide substrate width range of 50×70 to 400×500 mm, making it capable of handling large substrates. 【Features】 ■ Precise and high-quality heating performance ■ Low power consumption structure ■ Large capacity, high-efficiency flux recovery ■ Insulation design considerate of the working environment *For more details, please refer to the PDF document or feel free to contact us.

Company：協和電子部品本社
Price：Other

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Airflow device "AJ06 Series"

Ultra-low power consumption that promotes energy saving! Lightweight and compact air flow device.

We would like to introduce the Airflow Device 'AJ06 Series' manufactured by ETC Corporation, handled by Masu Shoji. The lineup includes "AJ06M-8" and "AJ06L-8." They feature a lightweight and compact design with high insulation that takes the working environment into consideration. The power supply is AC200V 3Φ, providing precise and high-quality heating performance. 【Features】 ■ Ultra-low power consumption that promotes energy savings ■ Precise and high-quality heating performance ■ High insulation design that considers the working environment ■ Lightweight and compact *For more details, please refer to the related links or feel free to contact us.

Company：マス商事
Price：Other

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A new technology for non-contact heating implementation using electromagnetic induction: "IH Reflow Technology."

Prototyping is possible! Non-contact soldering that can mount electronic components on low heat-resistant substrates such as PET, fabric, and paper! Achieving damage-free and 100% yield mounting instantly.

"IH Reflow" is a mounting technology that applies IH (induction heating), enabling instant, non-contact mounting of only the necessary parts without physical stress, allowing for damage-free implementation. This technology makes it possible to mount electronic components that are not heat-resistant on low-heat-resistance substrates such as inexpensive, flexible, and stretchable PET, paper, and fabric. Additionally, by applying this technology, it can replace the conventional mounting processes on high-heat-dissipation substrates that typically use lasers or manual soldering, dramatically improving production throughput. Sales of IH Reflow devices, bonding experiments, prototype contracting, and unique contract mounting services based on the core technology "IH Reflow" are also available. 【Features】 - Damage-free component mounting technology for low-heat-resistance and high-heat-dissipation substrates - Heating and mounting using electromagnetic induction - Achieves instant, damage-free, non-contact mounting at specific locations with a yield of 100% - Heating method: Induction heating only at the mounting points (single point to multiple points) - Capable of mounting on low-heat-resistance substrates and high-heat-dissipation boards *For more details, please refer to the PDF materials or feel free to contact us.

Company：ワンダーフューチャーコーポレーション
Price：Other

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Forced convection compact N2 reflow device 'NRY-520S-5Z'

Lead-free small-sized mounting board compatible compact N2 reflow device

The "NRY-520S-5Z" is a reflow device designed for electronic device manufacturers, aimed at improving temperature accuracy (in-plane temperature distribution) and soldering under low oxygen concentration. It is suitable for reflowing high-density mounted substrates through an independent upper and lower hot air circulation method that combines forced convection with a rectifying plate. 【Features】 - Clean room compatible, compact design, and energy-saving features - Equipped with five heating zones despite its small size - Capable of setting various temperature profiles - Can also be used for reflowing to form solder balls for BGA and CSP - Peripheral devices including loaders/unloaders and intermediate buffers are also available, etc. *For more details, please download the PDF or contact us.

Company：大和製作所
Price：Other

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Reflow device "NRY-101V6W/LU"

N2 reflow system for solder bump formation compatible with 6.8-inch wafers

The "NRY-101V6W/LU" is an N2 reflow device for bump formation after solder ball mounting or printing. The heating method combines a hot plate and an upper infrared heater. This allows for uniform temperature distribution through direct heat conduction. 【Features】 ■ Integrated loader and unloader design ■ Designed to fit the customer's magazine cassette ■ Handling into the furnace is made easy with a 3-axis clean robot, enabling inline integration with upstream equipment ■ A low-cost type that uses belt conveyor transport without a robot can also be manufactured ■ In-furnace transport is achieved through tact feeding with a walking beam (PAT.P), among other methods *For more details, please download the PDF or contact us.

Company：大和製作所
Price：Other

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Reflow device "NRY-103V6W/LU"

N2 reflow system for forming solder bumps compatible with 200-300mm wafers

The "NRY-103V6W/LU" is an N2 reflow device compatible with 200mm and 300mm printed bumps, which can also function as a wet back device after the plating bump process. The hot plate pins in the preheat zone utilize our unique liftable pins, enabling a two-stage heating temperature profile. (PAT.P) 【Features】 - Heating method combines hot plate and upper infrared heaters - The hot plate employs pin-based heating adapted to wafer warping - Excellent cleanliness within the furnace, and capable of low oxygen concentration (below 100ppm) - In-furnace transport uses our proprietary walking beam (PAT.) for tact feeding - Capable of high-precision transport with excellent cleanliness, among other features *For more details, please download the PDF or contact us.

Company：大和製作所
Price：Other

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N2 Reflow Device 'Nj0611M82-RLF'

Introducing the production equipment of VEMS Co., Ltd. compatible with a substrate size of L500×W400!

The "Nj0611M82-RLF" is an N2 reflow device compatible with a substrate size of L500×W400. It features 8 heating zones and 2 cooling zones. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Assembly Inspection 3. Manual Soldering 4. Assembly and Electrical Testing *For more details, please refer to the PDF document or feel free to contact us.

Company：VEMS
Price：Other

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Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

Fluxless wafer bump reflow device. Achieves fine bump reflow without wet processes. Sample demo available. Reflow video posted.

Fluxless reflow in a strong reducing H2 radical atmosphere of damage-free downflow-type surface wave plasma, reducing flux application and cleaning processes, as well as application and cleaning equipment. A completely dry CtoC system. Achieving a short tact reflow process for fine pitch bumps.

Company：神港精機東京支店
Price：Other

Other semiconductor manufacturing equipment
Reflow Equipment

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Model 1200 Vacuum and Pressure Reflow Device

The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.

SST is a global leader providing solutions and equipment for microelectronics assembly processes. We perform high-precision pressure management, including pressurization with vacuum and process gases, and offer solutions for processes such as voidless soldering, brazing, glass sealing, high-density sealing, moisture getter activation treatment, and wafer bonding.

Company：テクノアルファ
Price：1 million yen-5 million yen

Bonding Equipment
Reflow Equipment

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VPS Reflow Device

Achieve a stable temperature process! Capable of 3D implementation and accommodating three-dimensional structures!

At Techno Alpha, we handle the 'VPS Reflow Equipment' manufactured by IBL and R&D Vaportech. In the VPS method, products are immersed in a saturated vapor atmosphere obtained by heating a fluorinated inert heat transfer liquid (Garden), allowing the vapor that comes into contact with the product to release latent heat of vaporization and condense, enabling efficient and uniform heating of the product. This method is also effective for substrates with three-dimensional components, thick large substrates, and 3D mounting. 【Features】 ■ The vapor temperature is determined by the boiling point of the liquid used, allowing for uniform application of a constant temperature to the product. ■ Since the boiling point temperature of the liquid is utilized, the product is not exposed to temperatures above the specified temperature (= boiling point temperature), minimizing damage. ■ Because it uses vapor, it has higher thermal efficiency compared to hot air and infrared methods, improving mass production through reduced process time. *For more details, please refer to the PDF document or feel free to contact us.

Company：テクノアルファ
Price：Other

Reflow Equipment
Soldering Equipment
Reflow Equipment

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Reflow Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies | IPROS GMS

Reflow Equipment Manufacturer, Suppliers and Company Rankings

Reflow Equipment Product ranking