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Reflow Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Reflow Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. アントム Kanagawa//Electronic Components and Semiconductors
  2. ユニテンプジャパン Tokyo//Electronic Components and Semiconductors
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 エイテックテクトロン Tokyo//Industrial Machinery
  5. 4 アユミ工業 Hyogo//Electronic Components and Semiconductors
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Reflow Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Reflow device "SOLSYS-6310IRTP" アントム
  2. Atmospheric Dedicated Furnace Reflow Device "UNI-5016F" アントム
  3. Reflow device "UNI-6116H" アントム
  4. Reflow device "SOLSYS-8310IRTP" アントム
  5. 4 [Limited to 5 units] High-performance compact reflow device for atmospheric use UNI-5016A アントム

Reflow Equipment Product List

1～15 item / All 61 items

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Fluxless Reflow Device SR-300

Fluxless Reflow Device SR-300

Fluxless Reflow Device SR-300

This is a device characterized by performing reflow under reduced pressure using formic acid without the use of flux. 【Features】 ○ No need for flux application or cleaning processes. ○ Approximately 50% cost reduction is possible, and the installation space can be reduced to about one-third. ○ It can contribute to reducing environmental impact by decreasing CO2 emissions generated during flux cleaning by about 30%. ● For more details, please contact us or download the catalog.

  • Reflow Equipment

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[Comprehensive Catalog] Fluxless Reflow Equipment RF Series

[Comprehensive Catalog] Fluxless Reflow Equipment RF Series

It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.

The "Fluxless Reflow Device RF Series" can perform reflow under reduced pressure without using flux. Compared to conventional reflow processes that use flux, it eliminates the need for flux application and cleaning processes, reducing costs by approximately 50% and allowing for a reduction in installation space to about one-third. Additionally, it can reduce CO2 emissions generated during flux cleaning by about 30%, contributing to a decrease in environmental impact. Furthermore, due to the vacuum process, it can be processed without voids. For more details, please download the catalog or contact us.

  • Vacuum Equipment
  • Wafer processing/polishing equipment
  • Reflow Equipment

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Batch-type plasma reflow device (flux reflow)

Batch-type plasma reflow device (flux reflow)

Flux-free reflow device for fine wafer bumps. Sample test compatible, achieving energy-saving and short takt processes. Reflow video available.

Achieving flux-free bump reflow with highly reducing H2 radicals generated by high-density plasma (SWP). Reducing the application and cleaning processes of flux. Minimizing wet processes before and after reflow. An energy-saving, space-saving, and clean process that reduces the space, processing, and utilities of wet equipment. A cutting-edge mass production process compatible with 300mm wafers, suitable for batch-type hardware and niche devices with small-diameter substrates. Supporting short-tact batch processing for small-lot production and R&D applications.

  • Other semiconductor manufacturing equipment

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Model 5100 Vacuum and Pressure Reflow Device

Model 5100 Vacuum and Pressure Reflow Device

Batch-type vacuum pressure reflow that supports next-generation processes and achieves voidless results.

The "Model 5100" is a batch-type vacuum pressure reflow device manufactured by SST Vacuum Reflow Systems. It allows for automatic control of heating and cooling settings with high precision. The uniquely designed IR heater uniformly heats the entire process area while providing temperature feedback control in the process area. It is suitable for mass production of flux-free and void-free soldering for microelectronics packages and electronic components. Additionally, it has a proven track record in glass-metal bonding for RF power devices, crystal devices, image sensors, and in hermetic sealing, vacuum sealing, and lid sealing using eutectic bonding for aerospace and high-end industries. 【Features】 ■ Achieves flux-free and void-free soldering ■ Maximum temperature of 500℃ ■ Vacuum level of 10-5 torr (10-3 Pa) ■ Maximum chamber pressure level of 40 psig (3.7 bar, 0.37 MPa) ■ Realizes precise heating and cooling control ■ Equipped with a system that can optimally control temperature, vacuum, and pressure *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment
  • Welding Machine

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Reflow Device "UNI-3116H"

Reflow Device "UNI-3116H"

Compact lead-free compatible furnace. Number of heating zones: 3. Device length: 780mm.

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while being compatible with nitrogen. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far infrared, and is a lead-free type that is energy-efficient. 【Features】 ○ 3-zone heating with 780mm N2 reflow ○ Heating method using upper hot air circulation and upper and lower far infrared ○ Ideal for cell production, development, and evaluation applications For more details, please contact us or download the catalog.

  • Reflow Equipment

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Small Reflow Device "UNI-6116S"

Small Reflow Device "UNI-6116S"

A high-performance eco machine that pursues the coexistence of reflow performance and eco-friendliness. *Free distribution of the handbook "Characteristics of Far Infrared Reflow" is ongoing!

The UNI-6116S is a reflow oven that thoroughly pursues miniaturization. Most of the delivered units are used in clean environments. It adopts a heating method that combines hot air circulation and far-infrared radiation. It is an energy-saving, lead-free compatible model. 【Features】 ○ All heating zones can be set to 350°C ○ High-output heaters are used in the reflow zone ○ Suitable for high melting point solder and AuSn bonding ○ Significantly reduces power consumption ○ Nitrogen-compatible furnace For more details, please contact us or download the catalog.

  • Reflow Equipment

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Reflow device "UNI-6116H"

Reflow device "UNI-6116H"

Compact lead-free compatible machine. Number of heating zones: 6. Device length: 1,590mm.

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while still being nitrogen-compatible. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far infrared radiation, and is a lead-free type that is energy-efficient. 【Features】 ○ Combined hot air and far infrared heating from above and below ○ Maximum set temperature of 320℃ ○ Ideal not only for mass production but also for small-batch, diverse production ○ A wide range of options available to accommodate various applications For more details, please contact us or download the catalog.

  • Reflow Equipment

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Nitrogen-Compatible Reflow Device 'SOL-6136'

Nitrogen-Compatible Reflow Device 'SOL-6136'

Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,995mm.

The SOL-6136 is a medium-sized reflow oven for mass production lines that employs a heating method combining hot air circulation and far-infrared radiation from both the top and bottom. It is an energy-efficient, lead-free compatible machine that can be universally adapted for various production applications, including consumer electronics, industrial equipment, and EMS. 【Features】 - N2 reflow oven with a total length of less than 3 meters - Low oxygen concentration support of less than 100 ppm (optional) - Standard equipped with a flux recovery system For more details, please contact us or download the catalog.

  • Reflow Equipment

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Reflow device "SOLSYS-6310IRTP"

Reflow device "SOLSYS-6310IRTP"

Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,900mm.

The SOLSYS series is a medium-sized reflow oven that employs a heating method combining upper hot air circulation and upper and lower far infrared radiation. It is an effective reflow oven with a "floor heating effect" that helps suppress temperature rise in surface-mounted components. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, which has already contributed to space-saving. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far infrared radiation ○ Effective "floor heating method" for suppressing temperature rise in surface-mounted components ○ Compatible with effective substrate widths up to 310mm ○ Space-saving reflow oven for mass production with a total length of less than 3m ○ Ideal not only for reflow applications but also for screening and curing applications For more details, please contact us or download the catalog.

  • Reflow Equipment

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Reflow device "SOLSYS-8310IRTP"

Reflow device "SOLSYS-8310IRTP"

Compact lead-free compatible device. Number of heating zones: 8. Device length: 3,650mm.

The SOLSYS-Series is a medium-sized reflow oven that employs a heating method combining upper hot air circulation and upper and lower far-infrared radiation. It features a "floor heating effect" that is effective when you want to suppress the temperature rise of components on the upper side. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, which has already contributed to space-saving. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Supports effective substrate width up to 310mm For more details, please contact us or download the catalog.

  • Reflow Equipment

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[Limited to 5 units] High-performance compact reflow device for atmospheric use UNI-5016A

[Limited to 5 units] High-performance compact reflow device for atmospheric use UNI-5016A

Opportunity to introduce a new reflow oven at the same price as a used reflow oven!

Recently, many customers have started considering inexpensive used reflow ovens, but the reality is that many of them have become embroiled in troubles caused by the introduction of used reflow ovens. It is likely that due to the current economic situation and budget constraints, most customers feel they have no choice but to opt for inexpensive used reflow ovens. Conversely, if it were possible to introduce a new reflow oven for the same amount of money as a used one, there would be no reason to choose a used reflow oven. In that case, naturally, you would also be able to receive the manufacturer's warranty, and you could use the reflow oven with peace of mind, free from the risks associated with introducing a used reflow oven. We believe that preventing further customers from suffering significant losses due to the introduction of inexpensive used reflow ovens is our mission as a specialized reflow oven manufacturer with 44 years of accumulated technology and experience. This is why we have decided to sell the high-performance compact conveyor reflow oven UNI-5016A. For more details, please contact us or download the catalog.

  • Reflow Equipment

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N2 Reflow Device "RN152 Series" *Low power consumption considering the environment

N2 Reflow Device "RN152 Series" *Low power consumption considering the environment

We will exhibit at InterNepCon 2025! Improved temperature uniformity with a new type of nozzle! The N2 reflow device demonstrates astonishing flux recovery performance.

The "RN152 Series" is a high-performance N2 reflow device that exhibits remarkable flux recovery performance. It comes standard with two series of large water-cooled flux recovery units that efficiently recover flux in accordance with flux characteristics and air convection within the furnace. With the adoption of ETC's unique new nozzle and a detailed five-stage wind speed setting, it enables uniform heating without temperature variations for a wide variety of substrates. 【Features】 ■ Remarkable flux recovery performance ■ Dramatically reduces flux adhesion dripping issues ■ Improved temperature uniformity with the new nozzle ■ Easy height adjustment of the labyrinth ■ Environmentally and wallet-friendly low power consumption ■ Reduced time for changing set temperatures (high to low) 【Exhibition Information】 We will be exhibiting at Internepcon Japan 2025 from January 22 (Wed) to January 24 (Fri). We look forward to seeing you at the venue, Tokyo Big Sight (East Hall). *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

  • Soldering Equipment
  • Reflow Equipment

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RVS-210

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RVS-210

A model that is easy to maintain even with a high occurrence of contamination due to flux and other factors. Manufactured by Unitec Japan.

The RVS-210 is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for solving challenges related to no-clean and lead-free processes. In addition to "hydrogen reduction" for removing the oxide layer on the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid improves wettability even without flux. Despite its compact design, which is among the smallest in the industry, it condenses all the necessary functions and performance for various prototype developments into one unit. With a wide range of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Supports a maximum temperature of 400°C - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile with high repeatability and minimal overshoot - The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to contact us.*

  • Soldering Equipment
  • Reflow Equipment

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